Theme – EMBA Intelligence in Semiconductor Manufacturing

The accumulations of advancements in computational algorithms, computing powers and dynamic memory spaces during the past two decades, have succinctly reached a threshold that, with the final championship of machine over human at the most ancient strategic game of civilization, a new era of intelligent manufacturing has dawned in the semiconductor industry world-wide. The ultimate distillation process over integrated networks, from raw data to pixel information to packet knowledge to consolidated intelligence, has blossomed in uncharted wild fields with human imagination as the only limit.

Coupled with notions of Industry 4.0 with its cyber-physical systems over Internet of Things, from self-driving vehicles to nano-robot farms to self-fabricated devices in all kinds of realities, virtual or augmented, how to realize their impacts in the manufacturing processes bears critical importance on further advancements of the semiconductor industry. Four different aspects of innovative creations are identified: Engineering, Manufacturing, Business and Artificial intelligence, for crystallizing the magic balls.

TSIA/ISSM/SEMI/GSA endeavour to bring together all the experts and researchers from different fields to share their latest developments, break-through advancements, practical experiences and innovative ideas. Our focus has always been on cross-collaborations, operational strategies, technological innovations, and business partnerships.

History

2018　 Hsinchu, September 7, 2018	2017　 Hsinchu, September 15, 2017
2016　 Taipei, September 9, 2016	2015　 Taipei, September 2-3, 2015
2014　 Hsin Chu, September 12, 2014	2013　 with ISSM 2013 Hsin Chu, September 6, 2013
2012　 Hsin Chu, September 4, 2012	2011　 with ISSM 2011 Hsin Chu, September 5-6, 2011
2010　 with AEC/APC-Asia 2010 Hsin Chu, September 3, 2010	2009　 Taipei, October 2, 2009
2008 with AEC/APC-Asia 2008 Hsin Chu, September 27-28, 2008	2007 Taipei, June 14, 2007

Technical Sponsors

Technical Co-Sponsor