Program

08:15	Registration
08:50	Opening & Welcoming Addresses
09:00	keynote address- Challenges and opportunities for Taiwan High-technology industry Professor Chin-Tay Shih NTHU
09:45	invited talk How Artificial Intelligence is driving new compute architectures in an emerging memory centric world Steve Pawlowski Micron
10:30	Break
10:45	invited talk AI based Predictive Maintenance technology and workflows Rajesh Berigei MathWorks
11:15	invited talk Accelerating AI on FPGAs for Smart Manufacturing Dr. Ted Way Microsoft
11:45	invited talk Cognitive Enterprise - Reinventing your fabs with AI Ryuhichiroh Hattori IBM
12:15	lunch
13:30	invited talk Redefine your AI infrastructure Frances Chien Dell Technologies

14:00	Feature extractions from a high-dimension low-samples data for multi-dimension virtual metrology Hui-Zhen Bu U. Tsukuba
14:20	IC test quality enhancement by introducing machine learning BC Wu NXP
14:40	Mining factors impact wafer circuit probing via neural network and statistics for semiconductor device fabrication Hsiao Ying Yang UMC
15:00	Optimizing Chiller Switch-on Time Interval for Chiller Power Consumption Saving via Big Data Analytics and Machine Learning Framework Yu-Chu Tsai NTHU
15:20	Break
15:40	ISSM-2018 Best Paper Materials Informatics for Process and Material Co-optimization Fumiaki Tanaka TEL
16:00	Process control technique to dramatically reduce voids in phosphorus-doped poly-silicon for trench field-plate MOSFETS Saya Shimomura Toshiba EDS
16:20	Optimizing production performance through trace-level chamber analysis Kim Kok Gan BISTel
16:40	ISSM-2018 Best Paper Prediction of the Number of Defects in Image Sensors by VM using Equipment QC Data Toshiya Okazaki Sony Semiconductor
17:00	ISSM-2018 Best Paper Real-time Etch Control to Reduce First Wafer Effect in SF6/O2/Ar Plasma Sangwon Ryu Seoul National University
17:20	Adjour

14:00	Applications of hybrid flowshop schedulings under dynamic constraints of queue time and capacities Motoharu Tanaka U. Tsukuba
14:20	Analysis for dynamic statistical process control with interventions Lingyen Yeh Sun Innovation
14:40	Tungsten Gate Replacement Process Optimization in 3D NAND Memory Yung-Tai Hung Macronix
15:00	Novel manufacturing process for SI superjunction power MOSFETS with air-gap and insulating cap layer Yuhki Fujino Toshiba EDS
15:20	Break
15:40	Electrical failure analysis using SEM automated process inspection (API) system Yu-Chi Chen Powerchip
16:00	A measurement system analysis research framework for measurement system and empirical study with automation time-domain measurements Yu Mei Ling NTHU
16:20	ISSM-2018 Best Paper I Process Control Technique to Reduce Wafer Warpage for Trench Field Plate Power MOSFET Hiroaki Kato　 Toshiba EDS
16:40	Chemical-mechanical polishing process of STI and DTI Hsieh Chingyu Powerchip
17:00	Adjour

P1	The identification coding rules and the acceptance criteria of measuring instruments Chih-Jen Wang Powerchip
P2	A bipolar HFO2 based resistive RAM with high on/off ratio under different algorithm Chen Ching Hua Powerchip