
Program
Parallel Session
08:15 | Registration |
08:50 | Opening & Welcoming Addresses |
09:00 | keynote address- Challenges and opportunities for Taiwan High-technology industry Professor Chin-Tay Shih NTHU |
09:45 | invited talk How Artificial Intelligence is driving new compute architectures in an emerging memory centric world Steve Pawlowski Micron |
10:30 | Break |
10:45 | invited talk AI based Predictive Maintenance technology and workflows Rajesh Berigei MathWorks |
11:15 | invited talk Accelerating AI on FPGAs for Smart Manufacturing Dr. Ted Way Microsoft |
11:45 | invited talk Cognitive Enterprise - Reinventing your fabs with AI Ryuhichiroh Hattori IBM |
12:15 | lunch |
13:30 | invited talk Redefine your AI infrastructure Frances Chien Dell Technologies |
AI in Semiconductor Manufacturing
14:00 | Feature extractions from a high-dimension low-samples data for multi-dimension virtual metrology Hui-Zhen Bu U. Tsukuba |
14:20 | IC test quality enhancement by introducing machine learning BC Wu NXP |
14:40 | Mining factors impact wafer circuit probing via neural network and statistics for semiconductor device fabrication Hsiao Ying Yang UMC |
15:00 | Optimizing Chiller Switch-on Time Interval for Chiller Power Consumption Saving via Big Data Analytics and Machine Learning Framework Yu-Chu Tsai NTHU |
15:20 | Break |
15:40 | ISSM-2018 Best Paper Materials Informatics for Process and Material Co-optimization Fumiaki Tanaka TEL |
16:00 | Process control technique to dramatically reduce voids in phosphorus-doped poly-silicon for trench field-plate MOSFETS Saya Shimomura Toshiba EDS |
16:20 | Optimizing production performance through trace-level chamber analysis Kim Kok Gan BISTel |
16:40 | ISSM-2018 Best Paper Prediction of the Number of Defects in Image Sensors by VM using Equipment QC Data Toshiya Okazaki Sony Semiconductor |
17:00 | ISSM-2018 Best Paper Real-time Etch Control to Reduce First Wafer Effect in SF6/O2/Ar Plasma Sangwon Ryu Seoul National University |
17:20 | Adjour |
Engineering Excellence
14:00 | Applications of hybrid flowshop schedulings under dynamic constraints of queue time and capacities Motoharu Tanaka U. Tsukuba |
14:20 | Analysis for dynamic statistical process control with interventions Lingyen Yeh Sun Innovation |
14:40 | Tungsten Gate Replacement Process Optimization in 3D NAND Memory Yung-Tai Hung Macronix |
15:00 | Novel manufacturing process for SI superjunction power MOSFETS with air-gap and insulating cap layer Yuhki Fujino Toshiba EDS |
15:20 | Break |
15:40 | Electrical failure analysis using SEM automated process inspection (API) system Yu-Chi Chen Powerchip |
16:00 | A measurement system analysis research framework for measurement system and empirical study with automation time-domain measurements Yu Mei Ling NTHU |
16:20 | ISSM-2018 Best Paper
I Process Control Technique to Reduce Wafer Warpage for Trench Field Plate Power MOSFET Hiroaki Kato Toshiba EDS |
16:40 | Chemical-mechanical polishing process of STI and DTI Hsieh Chingyu Powerchip |
17:00 | Adjour |
Interactive Session
P1 | The identification coding rules and the acceptance criteria of measuring instruments Chih-Jen Wang Powerchip |
P2 | A bipolar HFO2 based resistive RAM with high on/off ratio under different algorithm Chen Ching Hua Powerchip |