In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:
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This Call for Papers is directed towards all industries but the communities of semiconductor, PV and SSL/LED (light-emitting diodes), flat-panel displays (FPD), packaging and testing are highly encouraged.
On-line electronic submission of extended abstracts in MSWord must be made by June 1, 2015 June 15, 2015. You should select the topic(s) your contribution best fits in from the list above.
Each paper (up to a maximum of 4-pages of A4-paper size, including texts and graphical illustrations) should clearly describe the purpose, the chosen approach, and the achieved results. Submission of insufficient length or detail shall be returned to the author(s) for amendments.
Presentations may be conducted in oral or interactive-poster formats. You may indicate your preference of presentation, and the program committee will decide the final selections. Presenters will be notified by June 20, 2015 July 1, 2015 and final presentations must be submitted in MS PowerPoint by July 31, 2015 in electronic format. Official language of the symposium is English.
- Title of Paper
- Author’s name(s), address and affiliation(s)
- Contact telephone/fax numbers
- E-mail address
- Presenter’s name
- Five keywords
| Deadline of submission | |
| Notification of acceptance | |
| Final presentation due | July 31, 2015 |
| Deadline for early-registration | August 15, 2015 |