| Program at a glance |
| Sept. 2 afternoon |
|
Keynote Session |
| Sept. 3 morning |
Special Session |
Engineering Excellence (I) |
| Sept. 3 afternoon |
Engineering Excellence (III) |
Engineering Excellence (II) |
|
Sept. 2
Co-Organizer : 
| Keynote Session |
Venue - Room 401 |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Opening Address and Today’s Taiwan Semiconductor Industry |
|
|
| 14:00 |
Keynote Speech -
Invention of Blue LED, Laser and Solid State Light |
Prof. Shuji Nakamura |
University of California, Santa Barbara |
| 14:50 |
Break |
| 15:20 |
Panel Discussion
- Dr. Nicky Lu (Moderator)
- Prof. Shuji Nakamura, University of California, Santa Barbara
- Dr. Chang San-cheng, Vice Premier, Executive Yuan
- Prof. M. C. Frank Chang, President, NCTU & Academician of Academia Sinica
- Dr. Tien Wu, COO, ASE
|
| 17:00 |
Adjourn |
|
Sept. 3
Special Session to be announced
| Special Session — IoT-I40 & BigData |
Room 616 |
| Time |
Topic |
Speaker |
Association |
| 09:00 |
Invited Speech
Convergence, a brief history of the future of the internet — Industry 4.0, Internet of Things and Industrial Internet in context |
Dr. Mark Mattingley-Scott |
IBM |
| 09:30 |
Invited Speech
A Comprehensive Infrastructure for Test Productivity and Yield Improvement across the Manufacturing Product Lifecycle |
Dr. Kenneth Harris |
PDF Solutions |
| 10:00 |
Invited Speech
Do the Things Right and Earlier – Project “Shift-Left” with Verification Continuum |
Thomas Li |
Synopsys |
| 10:30 |
Break |
| 10:40 |
Invited Speech
Big Data Business Model |
Pony Ma |
EMC |
| 11:10 |
Invited Speech
Big Data Analytics in Semiconductor Manufacturing and Test Operations: New Opportunities and Perspectives |
Dr. Paul Simon |
Qualtera |
| 11:40 |
Invited Speech
Using Data Analytics to Improve Process Tool Performance |
Dr. Helen Armer |
Applied Materials |
| 12:10 |
Lunch |
|
| Session — Engineering Excellence (I) |
Room 614 |
| Time |
Topic |
Speaker |
Association |
| 09:00 |
High-sensitivity negative-tone imaging materials using EUV exposure for sub-10 nm manufacturing |
Toru Fujimori |
EUVL IDC |
| 09:20 |
I-fuse: A Disruptive OTP Technology for with Excellent Manufacturability |
Shine Chung |
Attopsemi |
| 09:40 |
Capacitance Density and Breakdown Voltage Improvement By Optimizing the PECVD Dielectric Film Characteristics in Metal Insulator Metal Capacitors |
Chin-tsan Yeh |
Macronix |
| 10:00 |
450mm FOUP/LPU system in advanced semiconductor manufacturing processes |
Angus Shiue |
NTUT |
| 10:20 |
Break |
| 10:50 |
Advanced On-Tool Temperature Sensor and Process Integration |
Mei-Wei Tsao |
Wilmington Infrared |
| 11:10 |
Dishing and Erosion Amount Prediction According Pattern Density Calculation Algorithm in 3D Design Layout |
Kuang-Wei Chen |
Macronix |
| 11:30 |
Novel Solution for In-line Analysis of Noble Metallic Impurities on Silicon Wafer Surface |
Jiahong Wu |
Toshiba |
| 11:50 |
Evaluation of particle removal efficiency of filters in high temperature sulfuric acid using 30 nm liquid particle counter |
Tomoyuki Takakura |
Nihon Pall |
| 12:10 |
Lunch |
|
| Session — Engineering Excellence (II) |
Room 616 |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Data analytics in semiconductor industry |
David Wang |
MKS Umetrics |
| 13:50 |
Tool Log Mining for Productivity Improvement |
James Lin |
UMC |
| 14:10 |
Intelligent Sensitivity Tracking of Manufacturing Tool Tuning |
Chia-Jui Chuang |
tsmc |
| 14:30 |
Using Text Mining to Handle Unstructured Data in Semiconductor Manufacturing |
Yan-Hsiu Liu |
UMC |
| 14:50 |
Nondestructive in Chip Multi-Layer Weak Pattern Real Time Detection |
Hsin-Ming Hou |
UMC |
| 15:10 |
Break |
| 15:40 |
Optimization of Probe Capability using MPCpS |
Wiljelm Carl Olalia |
ON Semiconductor |
| 16:00 |
Production Control System to Integrate Lot-Level and Mass Volume Production Dispatching Rules for Output Optimization in a Wafer Fab |
Chih Ming Chan |
GlobalFoundries |
| 16:20 |
The Measurement of Wait Time in Non-productive Process of Process Units |
Chieh-yuan Tiao |
UMC |
| 16:40 |
Instantaneous generation of many flaked particles caused by micro-arc discharge and detection method using load impedance |
Yuji Kasashima |
AIST |
| 17:00 |
Adjourn |
|
| Session — Engineering Excellence (III) |
Room 614 |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Data Fusion at the Source: Standards and Technologies for Seamless Sensor Integration |
Alan Weber |
Cimetrix |
| 13:50 |
A Review of Variance Amplifications by APC |
K. Hui |
tsmc |
| 14:10 |
Six Sigma Approach of Eliminating Device Bad Trimming Issue |
Wiljelm Carl Olalia |
ON Semiconductor |
| 14:30 |
Inspection Sensitivity Improvement By Wafer Sort Failure Sites Matching Algorithm |
Yi-Ting Kuo |
Macronix |
| 14:50 |
Highly Effective and High Throughput Chipping Monitor to Prevent Wafer Cracking |
Chen-Hsuan Yen |
tsmc |
| 15:10 |
Break |
| 15:40 |
Advanced High Accuracy Scanning Electron Microscopy Review Methodology By Virtual Defect |
Yi-Ting Kuo |
Macronix |
| 16:00 |
Novel Adaptive Probing for Wafer Level Chip Scale Package |
Mincent Lee |
tsmc |
| 16:20 |
Six Sigma Approach of Understanding and Resolving Skip Ink Issue |
Wiljelm Carl Olalia |
ON Semiconductor |
| 16:40 |
Pattern Damage and Slurry Behavior Analysis of CMP Process by Mechanical and Fluid Simulations |
Yung-Tai Hung |
Macronix |
| 17:00 |
Adjourn |
|
**Final programme is subject to change without prior notice.
