| Time |
Topic |
Speaker |
Association |
| |
Parellal Session |
Venue ─ Ballroom B 10/F |
| 08:30 |
Registration |
| 09:00 |
Opening & Welcoming Addresses |
|
|
| 09:15 |
Facing Red Supply Chain When Moore's Law Is Ending |
Chin-Yung Shu |
HMI |
| 10:00 |
The Analytics of Things |
David Burgess |
SAS |
| 10:35 |
Break |
| 10:55 |
Cognitive Manufacturing in the Semiconductor Industry |
Dr. Rami Ahola |
IBM |
| 11:30 |
Data Analytics in Semiconductor Industry |
Hohyun Sung |
MathWorks |
| 12:05 |
Lunch |
| |
| |
Session — Technical Tutorial |
Venue ─ Ballroom B 10/F |
| 13:30 |
Part I -- Case Studies of Machine Learning for Manufacturing Intelligence |
Roger Jang |
NTU |
| 14:30 |
Part II -- Machine Learning Technologies for Semiconductor Industry |
Jeffrey Liu |
Terasoft |
| 15:30 |
Break |
| |
| |
Session — Engineering Excellence
|
Venue ─ Ballroom C 10/F |
| 13:30 |
Prioritization of Key In-Line Process Parameters for Electrical Characteristic Optimization of 16-nm High-k Metal Gate Bulk FinFET Devices |
Ping-Husn Su |
NCTU |
| 13:45 |
Fundamentals of side isolation LDMOS device with 0.35um CMOS compatible process |
Deivasigamani Ravi |
Asia University |
| 14:00 |
IPD Robustness Test Methodology for InFO |
Tang-Jung Chiu |
TSMC |
| 14:15 |
Advance Technique for Automatic Optical Inspection Process Optimization |
Wiljelm Carl Olalia |
ON Semiconductor |
| 14:30 |
Eliminating undercut profile of through silicon via by using nitrided fluorocarbon passivation in rapid alternating process |
Leonard Hsu |
Lam Research |
| 14:45 |
Novel InFO Wafer-Level-Chip-Scale-Package N-Leak Test and Stress |
Hao Chen |
TSMC |
| 15:00 |
Improvement of MIM Capacitor Early Breakdown by Metal Deposition Process Optimization and Ar Sputter Etch Implementation |
Chin-tsan Yeh |
Macronix |
| 15:15 |
Wet Clean Study on Cobalt Silicide and Contact Processes |
Shih-Ping Lee |
Powerchip Technology |
| 15:30 |
Break |
| |
| |
Session — Manufacturing Excellence |
Venue ─ Ballroom B 10/F |
| 16:00 |
The Role of Models in Semiconductor Smart Manufacturing |
Alan Weber |
Cimetrix |
| 16:15 |
Opportunity for Improving Fab Effectiveness by Predictive Overall Equipment Effectiveness (POEE) in Industry 4.0 |
Yu-Ting Kao |
National Taiwan University |
| 16:30 |
Heuristic Methods for Q-time Bottleneck Dispatching |
Ching-Lung Chang |
Winbond |
| 16:45 |
Capacity Simulation by Cellular Automation in Endura Platform |
Tung-He Chou |
Macronix |
| 17:00 |
Adjourn |
| |
| |
Session — Engineering Excellence |
Venue ─ Ballroom C 10/F |
| 16:00 |
Virtual Metrology for 3D Vertical Stacking Processes in Semiconductor Manufacturing |
Chun-Fu Chen |
Macronix |
| 16:15 |
New Process Variation Modeling Method of 3-D Capacitances for Advanced Nanometer CMOS Nodes Nodes |
Kuo-Fu Lee |
TSMC |
| 16:30 |
Research on Ion Implanter Transferring from Spot Beam to Ribbon Beam |
Yu-An Chen |
Powerchip Technology |
| 17:00 |
Adjourn |
