| e-Manufacturing & Design Collaboration Symposium 2014 |
Venue ─ Ballroom B 10/F |
| Time |
Topic |
Speaker |
Association |
| 08:30 |
Registration |
| 09:00 |
Opening & Welcoming Addresses |
|
|
| Keynote Session — Ecosystem Collaboration |
Venue ─ Ballroom B 10/F |
| 09:10 |
keynote speech ─
Industry Opportunities in the Deep Nanometer Era |
Suk Lee |
tsmc |
| 09:45 |
invited speech ─
IoT, Opportunity? Challenge? |
Robert Li |
Synopsys |
| 10:20 |
Break |
| 10:50 |
invited speech ─
Advanced Node Leadership Imperative |
Mitch Lowe |
Cadence |
| 11:25 |
invited speech ─
The Next 50 Billion Chips – Innovation Through Partnership |
Tim Whitfield |
ARM |
| 12:00 |
Lunch (Ballroom-A) |
|
| Special Session — BigData Applications |
Venue ─ Ballroom B 10/F |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Data Lake in Action: Real-time and Closed Loop Analytics |
Sean Lee |
EMC2 |
| 14:10 |
O2PLS for Improved Analysis and Visualization of Complex Data |
Lennart Eriksson |
Umetrics |
| 14:40 |
Big Data Journey to Fight Against Cybercrime |
Chung-Tsai Su |
Trend Micro |
| 15:10 |
Break |
| 15:40 |
Derive fast value from all the Big Data with Enterprise Security |
Nicholas Hsiao |
HP |
| 16:20 |
Open Innovation in the Social Era: Preparing for the disruptive innovations thru social collaboration |
Andy Kim |
IBM |
| 16:50 |
Data Supply Chain for Big Data Era |
Wen-Tsau Chiu |
SAS |
| 17:20 |
Adjourn |
|
| Session — Engineering Excellence |
Venue ─ Ballroom C 10/F |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Simulation-Based Wip Management Versus Scheduling For Semiconductor Manufacturing – A Comparison |
Peter Lendermann |
D-SIMLAB |
| 13:50 |
On the Dynamics of Topological Patterns in Statistical Imputation |
K. Hui |
tsmc |
| 14:10 |
Do We Still Need Daily Production Target Setting in Fully Automated Fabs |
Chun-Ming Chang |
NTU |
| 14:30 |
Advanced Process Control of Effective Field Height in a Single Wafer Spin Cleaning Tool |
Wen-Ming Chang |
Macronix |
| 14:50 |
3D Interconnect Simulation Applied to CMP Thickness Variations |
Shi-Hao Huang |
Synopsis |
| 15:10 |
Break |
| 15:40 |
The technology about coordination of the production process associated with complex product based on Task-Kitting-Crafts |
Xue Zhen |
BIT |
| 16:00 |
FOUP Mini-Environment Contaminants Analysis in Semiconductor Manufacturing |
YiTing Kuo |
Macronix |
| 16:20 |
Sensitivity Integrity for tool monitoring |
Po Feng Tsai |
tsmc |
| 16:40 |
Tiny Physical Defects Inspection by Optimized EBI Methodology |
Liao Hsiang-Chou |
Macronix |
| 17:00 |
Adjourn |
|
| Special Session — Hardware Collaboration |
Venue ─ Mezzanine A+B 13/F |
| Time |
Topic |
Speaker |
Association |
| 13:30 |
Win-Win Solution for Semiconductor Hardware-Makers and Device-Manufacturers |
J.R. Pai
白峻榮 |
tsmc |
| 14:00 |
Integrating Existing Capabilities of Local Companies for Making Critical Spare Parts to Meet Logistic Demand of Semiconductor Industry |
Bob Chen
陳漢穎 |
WavePower
宏碩 |
| 14:30 |
Think Big, Act Small, Learn Rapidly and Build for longterm |
John Wing
溫健宗 |
Evest
元利盛 |
| 15:00 |
EFEM total solution for next generation process |
Young Y.H. Hung
洪陽浩 |
Hirata
平田 |
| 15:30 |
Break |
| 16:00 |
Experiences in the making of electronic machines |
Lance Wang
王少甫 |
CTTEK
程泰 |
| 16:30 |
Applications of laser drilling techniques
雷射鑽孔技術簡介與應用 |
Y.P. Chen
陳育斌 |
TongTai
東台 |
| 17:00 |
Importance of Precision Parts Cleaning for Sub‐20nm Technology Nodes |
Ardeshir Sidhwa |
QuantumClean |
| 17:30 |
Adjourn |
|
**Final programme is subject to change without prior notice.
