| Time |
Topic |
Speaker |
Association |
| 08:30 |
Registration |
| 09:00 |
Opening & Welcoming Addresses |
Dr. Nicky Lu
Thomas Chen
Terry Tsao
Shozo Saito
|
TSIA/GSA
tsmc
SEMI
ISSM |
| 09:10 |
keynote speech ─
Next Step for Taiwan Memory Industry
|
Stephen Su |
IEK |
| 09:55 |
invited speech ─
Challenges in Moving to a 3D Semiconductor World |
Shu-Wen Chang |
Mentor |
| 10:25 |
Break |
| |
|
|
|
| Special Session — BigData Applications |
Venue ─ Ballroom B 10/F |
| 10:55 |
keynote speech ─
Big Data and Big Opportunities |
Mahendra Tadikonda
|
Intel |
| 11:40 |
invited speech ─
A Methodology and Infrastructure for Variability Reduction using BigData |
Kenneth Harris |
PDF |
| |
|
|
|
| Session — Engineering Excellence (I) |
Venue ─ Ballroom C 10/F |
| 10:55 |
Addressable test-chip compiler for test chip design automation and transistor/yield characterization |
David Ouyang |
U. Zhejiang |
| 11:10 |
Methodology to Review Chamber Type Equipment Performance |
Pei Shan Leong |
SSMC |
| 11:25 |
Reliable Screening for Zero-Defect Quality improvement by Temperature Gradient Testing |
Qianyi Wang |
Toshiba |
| 11:40 |
The 3-D Parallel Processor applied to Matrix Multiplication |
Karl Cheng |
Innotest |
| 11:55 |
A Novel Test Module for Interconnect Diagnosis Enhancement and Quality Improvement in Daisy Chain Test |
Chung-Han Huang |
TSMC |
| 12:10 |
Lunch (Ballroom-A) |
|
|
|
|
| Special Session — BigData Applications |
Venue ─ Ballroom B 10/F |
| 13:30 |
keynote speech ─
Predictive Analytics Applications in e-Manufacturing |
Greg Whalen |
EMC2 |
| 14:15 |
invited speech ─
How Big Data helps to Improve the Efficiency & Productivity of Your Core Business |
Li-Wen Chen |
Trend |
| 14:45 |
invited speech ─
Big Data Analytics - Moving the Analytics to the Data |
Deepak Ramanathan |
SAS |
| 15:15 |
Break |
| 15:45 |
invited speech ─ |
Eddy Lin |
IBM |
| 16:15 |
invited speech ─
Semiconductor Manufacturing 3.0 Moving towards zero defect |
Dan Somers |
SAP |
| 16:45 |
invited speech ─
Integrated Semiconductor Data Mining Solution |
Sahm Kim |
Microsoft |
| 17:15 |
invited speech ─
Industry's First Manufacturing Intelligence Solution based on Big Data Technology |
Tom Sonderman |
BISTel |
| |
|
|
|
| Session — Fab Management |
Venue ─ Ballroom C 10/F |
| 13:30 |
Proactive Control of Engineering Operations and Lot Loadings of Product-mix and Re-entrant in Q-time Constraints Processes |
Naoto TOYOSHIMA |
U. Tsukuba |
| 13:45 |
The art of sampling reduction |
K Hui |
TSMC |
| 14:00 |
Matrix cluster system concept for 450mm manufacturing |
Fumitake Mieno |
SMIC |
| 14:15 |
Two-Phase Simulation-Optimization for Vendor Selection and Order Allocation in a Solar Cell Manufacturer |
Chia-Yen Lee |
NCKU |
| 14:30 |
Material Receipting and Transference Operation Platform Optimization |
Kai Lun Lin |
UMC |
| 14:45 |
Electric Facility Design through the Virtual Fab Simulator |
Shunichi Ono |
Toshiba |
| 15:00 |
Wet Bench Chemical Usage Efficiency & Tool Productivity |
Sok Theng Tan |
SSMC |
| 15:15 |
Break |
| 15:45 |
Re-entrant Flow Control in Q-time constraints Processes for actual applications |
Akihiro KOBAYASHI |
U. Tsukuba |
| 16:00 |
Optimal lot sizing for 3DIC products in backend manufacturing |
Yun Chu Chen |
TSMC |
| 16:15 |
Bottleneck-Centric Pull and Push Allocation and Sequencing of Wet-bench and Furnace Tools |
Yu-Ting Kao |
NTU |
| 16:30 |
Breakthrough of 6% People Productivity Improvement via the Development of Cloud Monitor |
Yung-Ho Chen |
TSMC |
|
|
|
|
| Session — Engineering Excellence (II) |
Venue ─ Ballroom D 11/F |
| 13:30 |
Penetration behavior of airborne particles into wafer environment |
Masaki Hirano |
Toshiba |
| 13:45 |
FOUP N2 Purge Engineering in Fab |
Yiting Kuo |
Macronix |
| 14:00 |
Conversion from Helium to Nitrogen as a TEOS Carrier Gas in Sub-Atmospheric Chemical Vapor Deposition |
Tatsunori Murata |
Renesas |
| 14:15 |
Study of Various Fittings Used on Bulk Chemical Supply System |
Yung-I Chang |
TSMC |
| 14:30 |
Ultrasonic and Megasonic cleaning to remove Nano-Dimensional contaminants from various disk drive components |
Vetrimurugan Rajagopal |
Crest Ultrasonics |
| 14:45 |
Study of Fab Tool Waste Drain Separation and Reduction Application in Bump Process |
Larry Lai |
TSMC |
| 15:00 |
x-dimension of e-diagnosis loading for improve people productivity |
Hong Kai Lin |
TSMC |
| 15:15 |
Break |
| 15:45 |
Efficiency of Risk Reduction by Installation of Seismic Isolation System for Vertical Furnace |
Kaori Komoda |
Taisei |
| 16:00 |
Quasi-Blind Voltage Contrast In e Beam Inspection |
Hsiang-Chou Liao |
Macronix |
| 16:15 |
Holistic CD metrology for process control of Directed Self-Assembly |
Masafumi Asano |
Toshiba |
| 16:30 |
Inspection Flow of Yield Impacting Systematic Defects |
Chimin Chen |
Macronix |
| 16:45 |
A Novel Multiple Resolution APC on CMP and Litho-Etching |
Andy Tsen |
TSMC |
| 17:00 |
Detecting Buried Voids in Copper Interconnect |
Hsiang-Chou Liao |
Macronix |
| 17:15 |
Iterative Backward Elimination PLSR: A novel PLS-based modeling technique to eliminate noise components for VM solutions |
Naveen Neelapala |
TSMC |
| 17:30 |
Adjourn |
|
|
|
|
| Interactive Session |
Venue ─ Corridor Area 10/F |
| Time |
Topic |
Speaker |
Association |
09:00
~
17:00 |
28nm Back End Lithography Productivity Cycle Time Improvement 40% |
Rui-Pei Wang |
TSMC |
| Automatic defect detection and classification for color filter and micro-lens manufacturing |
Ying-Jen Chen |
NTHU |
| CVD chamber design to improve deposition quality in both 300- and 450-mm wafers with 3D-chamber modeling and experimental visual technique |
Ming-Han Liao |
NTU |
| Innovative Precise-Environment Design and Technology of Removing the Pollutant from a Clean Room |
Liang-Kun Zhu |
TSMC |
| Nonlinear analytic model for the strain field induced by thermal copper filled TSVs |
Ming-Han Liao |
NTU |
| Simulation Model and Multi-Criteria Decision Making for Layout Design of Cellular Manufacturing in a Solar Cell Manufacturer |
Taho Yang |
NCKU |
| Study of water contamination for Thermal process system |
Tomohito Matsuo |
TEL |
