September 15 -- Joint Symposium of eMDC-2017 & ISSM-2017 |
Time |
Topic |
Speaker |
Association |
08:30 |
Registration |
09:00 |
Opening & Welcoming Addresses |
Dr. Ian Chan
Terry Tsao
Robert Chien
J Chiang
Shuichi Inoue |
TSIA
SEMI
tsmc
GSA
ISSM |
09:10 |
keynote address
Heterogeneous Integration in Silicon Age 4.0 Delivering Intelligences for VR/AR, Robotics and AI |
Dr. Nicky Lu |
Etron |
09:55 |
invited talk
Design and implementation of I4.0 Smart Manufacturing in Semiconductor BE |
Dr. Jonathan Chang |
Infineon |
10:25 |
Break |
10:55 |
invited talk
What is Deep Learning, and how can it help me? |
Dr. John Wang |
MathWorks |
11:25 |
invited talk
Using Real-Time Data Acquisition and Big Data Analytics Across Global Semiconductor Manufacturing Chains |
Calvin Kuo |
Qualtera |
11:55 |
Lunch |
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Afternoon |
Special Session — AI in Semiconductor Manufacturing |
Time |
Topic |
Speaker |
Association |
13:30 |
invited talk
Smart Fault Detection Using Artificial Intelligence |
Tom Ho |
BISTel |
14:00 |
invited talk
From AV to AI |
Dr. Spark Tsao |
Trend Micro |
14:30 |
invited talk
AI in Semiconductor Design and Manufacturing |
Dr. Vijay Sankaran |
IBM |
15:10 |
Break |
15:40 |
Session — Engineering Excellence (II) |
15:40 |
Wafer Pattern Classification and Auto Disposition by Machine Learning |
James Lin |
UMC |
16:00 |
The productivity opportunities by applying machine learning algorithms in a fab |
Chia-Yu Lai |
TSMC |
16:20 |
Best Paper of ISSM-2016
Visualization technique of maintenance work with motion capture sensors |
Munehito Kagaya |
TEL |
16:40 |
Real-time Resource Allocations and Shceduling of Product-mix Production Systems with Multi-type jigs |
Yutaka Akiyama |
U. Tsukuba |
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Afternoon |
Session — Engineering Excellence (I) |
Time |
Topic |
Speaker |
Association |
13:30 |
Device Scaling vs. Process Control Scaling: Advanced Sensorization Closes the Gap |
Mark Reath
Alan Weber |
GLOBALFOUNDRIES
Cimetrix |
13:50 |
ANYSYS Chip-Level and Wafer-Level Simulation on Semiconductor Process Development |
Yu-Chih Chang |
Macronix |
14:10 |
Design of a 60V-n-NLDMOS device based on thermal oxide technology for improvement of HCI |
Syed Sarwar Imam |
Asia University |
14:30 |
Dual Port SRAM Read-Disturb-Write mechanism and design for test |
Robert Lo |
tsmc |
14:50 |
Best Paper of ISSM-2016
Plasma Erosion Behavior of Yttrium Oxide film formed by ADM |
Hiroaki Ashizawa |
TOTO |
15:10 |
Break |
15:40 |
Best Paper of ISSM-2016
Layout-based Test Coverage Verification for High Reliability Devices |
Yoshikazu Nagamura |
Renesas |
16:00 |
Target and Uniformity Controls of WLP in SSL/LED manufacturing |
K Hui |
tsmc |
16:20 |
A Promising Solution to Reduce Plasma Induced Damage (PID) of High Density Plasma (HDP) Oxide without Sacrificing the Gap-fill and Throughput Performance |
Chin-tsan Yeh |
Macronix |
16:40 |
Understanding and Controlling Wafer Surface Contamination at Wafer Level Chip Scale Package |
Wiljelm Carl Olalia |
ON Semiconductor |
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Afternoon |
Session — Manufacturing Excellence |
Time |
Topic |
Speaker |
Association |
13:30 |
New RMS Design Based on SEMI E170 Secured Foundation Of Recipe Management System |
Masahide Hirouchi |
IBM |
13:50 |
Real-time Shceduling of HMLV Productions using the Optimum Production Cycle extended by ATSP Solver |
Bu Huizhen |
U. Tsukuba |
14:10 |
A Novel Method of WTW for Productivity Improvement |
NS Shen |
UMC |
14:30 |
Resolution of Die Chippings thru Determination of Occur and Escape Cause at Automatic Optical Inspection Process |
Wiljelm Carl Olalia |
ON Semiconductor |
14:50 |
Best Paper of ISSM-2016
New Method of Screening Out Outlier (Expanded PAT during Package Test) |
Tadashi Sakamoto |
JSC |
15:10 |
Break |
15:40 |
Dynamic Shceduling of Product-mix Production Systems - Periodical Priority Dispatching and OPCs |
Beizhu Zhang |
U. Tsukuba |
16:00 |
Safety shutdown of process equipment by automatic remote operation |
Kuniaki Ishimoto |
JSC |
16:20 |
Particle removal efficiency evaluation of filters in high temperature IPA |
Tomoyuki Takakura |
Nihon Pall |
16:40 |
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|
Afternoon |
Session — Interactive |
Time |
Topic |
Speaker |
Association |
13:30 |
A practical flow regarding 2nd party audit on quality proficiency in supplier management |
Chien-Hui Lu |
Powerchip |
An Universal Method to optimize Shrunken Distance of the Step Plate |
Yun-Chieh Tseng |
Powerchip |
Base on Bias and Process capability index monitoring mechanism to improve tool consistency |
Tzu-Ting Wang |
Powerchip |
The Application of TRIZ Algorithm to solve the problem of byproduct |
Yi-Fang Hsin |
Powerchip |
To improve the Measure Fail Rate On SEM through Six Sigma DMAIC methodology |
CC Chao |
Powerchip |
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Adjourn |