Session I ─ Business Operatives | |||
Time |
Topic |
Speaker |
Association |
08:30 |
Registration | ||
09:00 |
Opening & Welcome Address | Dr. TY Wu Mr. Thomas Chen Mr. Terry Tsao Dr. Jeremy Wang |
TSIA tsmc SEMI GSA |
09:05 |
keynote speech ─ Collaborate to Overcome New Design Complexity Barrier |
Dr. Shauh-Teh Juang | Senior Director, TSMC |
09:50 |
Integrated Innovation and Collaboration in a Semiconductor Disintegrated Ecosystem | Dr. Jaushin Lee | President and CEO, Imera Systems |
10:20 |
tea break |
||
10:40 |
Enablers for Manufacturing Technology Integration | Mr. Reiner Missale | CEO, Critical Manufacturing S.A. |
11:10 |
IP Royalty management in Semiconductor Industry | Mr. K Saj Kumar | Vice Presiden of Hi-Tech Industry, SAP APJ |
11:40 |
Achieving optimal efficiencies of vertical integrations along a horizontal supply chain | Mr. John Cheng | Director of supply chain management, Verigy Ltd |
12:10 |
lunch break |
||
Session II ─ Technology Operatives | |||
13:30 |
keynote speech ─ Globalization and Innovation |
Mr. Ron Kao | General Manager, Broadcom Taiwan Design Center & Asia Business Development |
14:15 |
A Pattern-Based Design Platform for High Manufacturability | Dr. Kimon W. Michaels | VP Design for Manufacturability, PDF Solutions, Inc. |
14:45 |
Gaining a Competitive Advantage with DFM | Ms. Shu-Wen Chang | Foundry Program Manager, Mentor Graphics Taiwan |
15:15 |
End-to-End Product Information Integration for the Semiconductor Industry | Mr. You-Min Lin | Business Consultant, Siemens PLM Software |
15:45 |
tea break |
||
16:05 |
Yield Mine for WAT Issue Investigation | Wei Jun Chen | Inotera |
16:35 |
A modified PLS based d-EWMA controller for furnace process | James Yang | Nanya Technology Corporation |
17:05 |
A Study of Virtual Metrology for ETCH process in Semiconductor Manufacturing | Ferna Huang | ProMOS |
Poster
The Advanced Root Cause Finding System in Semiconductor Field
Self-tuning Interlayer Dielectric Gap Fill Process
Defect Management with WIP and Care Area in the Fab
Automated Multivariate Analysis for Yield Issue Investigation