Home  >  Program     Thursday November 27, 2008 Friday November 28, 2008 Opening Address / Invited Speakers Invited Speakers Session 1: APC Session 2: AEC   Session 3: VM Session 4: DFM/DFT/DFY Session 5: e-Manufacturing     November 27, 2008     10F Ballroom A Opening Address / Invited Speakers Session Chair: Dr. Brad Van Eck   08:30 Opening Address   TSIA       08:35 Keynote Speech - Next Generation Manufacturing Mr. Reiner Missale Qimonda       09:20 Automatic Virtual Metrology Prof. FT Cheng NCKU       09:50 A Reverse Engineering Look at DFM at the Latest Geometries - Challenges and Results Gary Tomkins Chipworks       10:20 Break   10F Ballroom A Session 1 - APC Session Chair: Dr. HW Chou 10F Ballroom C Session 2 - AEC Session Chair: Dr. SR Wang 10:50 A Run-to-Run On-line Adaptive PID Control with Neural Network Identification for Semiconductor Process Tzu-Ming Liu NTC Dynamic Test-cell Controller Rob Marcelis Salland Engineeing 11:20 Run-to-Run Control of Photolithography Alignment Shih-Tsung Hsiao Powerchip A Thru-Window Remote Wafer Temperature Sensing Technology and Its Applications in Process Monitoring Mei-Wei Tsao Wilmington Infrared 11:50 EWMA Controller Tuning and Performance Evaluation in a High Mixed System Ming-Da Ma HIT/NTHU An Evolution of Conventional W CVD using In-situ MFC Monitoring Chen-Ling Lee Macronix 12:20 Lunch (10F Ballroom B)   10F Ballroom A Session 1 - APC Session Chairs: Dr. HW Chiou & Dr. SR Wang 10F Ballroom C Session 3 - VM Session Chair: Dr. CH Lin 01:45 Development of Gate CD Control for Both Isolated and Nested Patterns on a Wafer Masakazu Hayashi Fujitsu Virtual Metrology using EES and OES data Hitoshi Takagi Sony 02:15 AEC/APC Applications for Preventive Maintenance Qualification in a Semiconductor FAB Roger Tung ProMOS Cross Module APC and Virtual WAT Using VM in CUCMP Lian Hua Shih UMC 02:45 Application of feedback control to capacitor of DRAM manufacturing Jyun-Da Wu Powerchip Advanced Cycle Time Predictor system via Cluster analysis, Decision Tree, Neural Network, and Fuzzy Yi Feng Lee Inotera 03:15 Break 03:45 Effective Real-Time Monitor and Excursion Prevention by Utilizing Healthy Index System Dophi Lin Macronix Reduction in NPW for EQC* process by Virtual Metrology using EES data Eiichi Murayama Sony 04:15 High-speed RF Arc Detection in Etch Processing Mei Ling Chen INFICON Yield Based Preventive Maintenance Qualification James Lin UMC 04:45       Self-tuning HDP CVD Gapfill Process Sheng-Hui Hsieh Macronix 05:15 Reception top   November 28, 2008     10F Ballroom A Invited Speakers Session Chair: Dr. Allan Chen   09:00 Qualcomm Design-for-Si Initiatives Dr. Riko Radojcic Qualcomm       09:30 Routing for Manufacturability Prof. YW Chang NTU       10:00 Break   10F Ballroom A Session 4 - DFM/DFT/DFY Session Chair: Prof. YW Chang 10F Ballroom C Session 5 - e-Manufacturing Session Chair: Gino Crispieri 10:30 Guidepost for semiconductor manufacturing - Activity report of JEITA DFM Production Management Subcommittee Takashi Sato TOSHIBA Recipe Management Strategies for Next Generation Factories Lance Rist ISMI 11:00 Interconnect Design for Copper Chemical Mechanical Polish Process in Nanoscale Semiconductor Manufacturing Hung-Wen Chiou ProMOS Zero-Cost Wafer Fab’s Capacity Optimizer Loh Hie Hua X-FAB 11:30 Lithography Hotspot Discovery at 70nm DRAM 300mm Fab : Process Window Qualification Using Design Based Binning Daniel Chen Inotera Joint Statistical and Cost Effectively Design for Assembly Sampling Scheme Sam Yan-Hong Lin NXP 12:00 Lunch (10F Ballroom B)   10F Ballroom A Track A - DFM/DFT/DFY Session Chair: Dr. YJ Tsai 10F Ballroom C Track B - e-Manufacturing Session Chairs: Gino Crispieri & LanceRist 01:45 In-Line Overlay Alignment and Critical Dimension Design for Nanoscale Semiconductor Manufacturing Hung-Wen Chiou ProMOS Recipe and Parameter Management: Ready for Next Generation Factories Lance Rist ISMI 02:15 A Flexible and Practical Design Methodology for On-Chip Process Monitor Adrian Yu-Ting Hung Faraday Benefit of Inspection Recipe Optimization with RICO in a High Volume Production Fab Vicent Lin Inotera 02:45 Analysis method for Airborne Molecular Contamination reduction in semiconductor process fab Hisanori Kambara Adixen-Alcatel Material Cost Reduction Measurement And Method in 8 inch Semiconductor Manufacturing Yeo Hui Ling X-FAB 03:15 Break 03:45 Prediction and Control of In-Line Defect Damage on Backend Yield Alan Wang ProMOS KPI Data Warehouse Architecture in Final Manufacturing Morgan R. Bickle AMD 04:15 A Characterization Work to an Engineering Data Analysis System in Semiconductor Fabrication Jiunn-Cherng Wang Tungnan University Experiences and Improvements During Adoption of the Equipment Data Acquisition (EDA) Iinterface Gino Crispieri ISMI 04:45 Sensor-integrated HDP CVD Process Shing-Ann Luo Macronix IMDB Used in MES for High-volume Manufacturing Leo Ku ProMOS 05:15 Break 05:30 Banquet (10F Ballroom B) top   Poster   Yield Impact Model with FDC Data Brandon Lee MKS   Copyright © 2008 TSIA    [ website design/webhosting by fansio ] Hotel   |   About Taiwan   |   Contact Us