 |
| |
Taiwan Semiconductor Industry Association |
| |
 |
| |
‧Science Park Admistration
‧Semiconductor Industry Promotion Office (IDB)
‧Chinese Institute of Automation Engineers
‧Global Semiconductor Alliance
‧SEMI Taiwan
‧Society of Manufacturing Engineers (Taipei)
‧Taiwan TFT-LCD Association |
| |
 |
| |
IEEE-RAS Technical Committee on Semiconductor Factory Automation |
| |
 |
| |
‧Dr. TY Wu, President, TSIA
‧Mr. Thomas Chen, Director, tsmc
‧Dr. Cheng-Wen Wu, ITRI
‧Dr. Brad Van Eck, ISMI
‧Mr. Terry Tsao, President, SEMI Taiwan
‧Dr. Jeremy Wang, AP Executive Director, GSA |
| |
 |
| |
General Chair:
‧Dr. Allan Chen (tsmc) |
| |
Programme Chair:
‧Dr. C. Hsu (tsmc)
‧Prof. Yao-Wen Chang (NTU)
‧Prof. Argon Chen (NTU)
‧Prof. Fan-Tien Cheng (NCKU)
‧Dr. H.W. Chiou (ProMOS)
‧Prof. Yon Chou (NTU)
‧Mr. Leon Huang (SEMI)
‧Prof. Daniel Sheu (NTHU)
‧Prof. Kuen-Yu Tsai (NTU)
‧Dr. S.R. Wang (PSC) |
| |
Logistics:
‧Ms. Celia Shih (TSIA) |
| |
Coordinator:
‧Dr. Andy Tsen (tsmc) |
| |
 |
| |
http://www.tsia.org.tw/Seminar/
eManufacturing/2008/ |
| |
 |
| |
symposia@tsia.org.tw |
| |
 |
| |
Ms. Celia Shih
Tel: +886-3-5917092
Fax: +886-3-5820056
E-mail: celia@itri.org.tw
Rm. 1246, Bldg. 51, 195, Sec. 4. Chung Hsing Rd., Chutung. Hsinchu, 310 Taiwan R.O.C |
|
|
 |
| |
The Semiconductor Industry has undergone drastic transformation in recent years. This has been driven by the sudden expansion of manufacturing capacities worldwide in 300mm wafers, and also by the rapid evolution of manufacturing capabilities. These transformations span full-scale functional integrations from shop-floors up to top-level corporate operations. This transformation is in constant acceleration and accompanies the stringent technological requirements of ever-shrinking device dimensions required to meet the unquenchable thirst of human demands on all digital inventions, large or small. The very large investment in each 300-mm wafer fabrication factory creates a huge financial burden. At the same time, factories must cut operating costs and reduce cycle-time while remaining flexible in order to respond immediately to market changes. |
| |
 |
| |
With all the prevailing notions of supply/engineering/value chains and many others, e-Manufacturing has been identified to unify the synchronized integration as a critical link. The Symposium will review recent technological advancements to assure alignment with the needs of integrated circuit manufacturers, semiconductor equipment suppliers, software suppliers, sensors and metrology suppliers. Major issues and experiences on AEC/APC/e-Manufacturing/DFM will be discussed in this two-day event, which also includes a technical tutorial and supplier exhibition. This offers a public arena for the exchange of up-to-date experiences among Asian manufacturers for adoption of recent technological developments.
This Call for Papers is directed towards all industries but the semiconductor community is highly encouraged. Topics of interests include, but not limited to, the following: |
|
| |
Applications in high-volume manufacturing
Automated Material Handling System
Benefits and justification (ROI, CoO, OEE ...)
Control Architecture/Engineering/IT
Infrastructure
Data Collection/Quality/Storage/Management
Design for Manufacturing/Testing/Yield
e-Diagnostics, e-Manufacturing, and EEC
Engineering/Supply/Value Chains
Equipment Communication/Integration
Factory Integration/Operations
Factory-Wide Applications and Deployment
Fault Detection & Classification
Future APC/FDC Needs and Requirements
Integrated /Virtual Metrology
Manufacturing Execution Systems |
Real -Time & Defect/Yield Databases
Piggyback and SCADA controllers
Predictive/Preventive Maintenance
Process modeling and model-based control
Real -time data collection and management
Real -Time Decision-Making
Run-to-Run/Wafer-to-Wafer/Real-Time
Control
Scheduling & Dispatching
Sensor development and implementation
Sensor integration into existing process tools
Sensor/actuator bus and intelligent sensors
Specification Management
Standards (Communication, Sensor Bus ...)
Tool Productivity Data Collection/Analysis
WIP Management |
|
| |
 |
| |
Electronic submission of extended abstracts in MSWord or PDF format must be made by Jul 1, 2008 directly to symposia@tsia.org.tw. You should select the topic(s) your contribution best fits in from the list above.
Each abstract (up to a maximum of 2-pages of A4-paper size, including texts and graphical illustrations) should clearly describe the purpose, the chosen approach, and the achieved results.
Presentations may be conducted in oral or interactive-poster formats. You may indicate your preference of oral or poster presentation, and the program committee will decide the final selection of oral presentations. Presenters will be notified by Aug 22, 2008 and final presentations must be submitted in MS PowerPoint by Oct 20, 2008 in electronic format. Official language of the symposium is English. |
|
| |
| All submissions must include |
| - Title of Paper |
- Author's name(s), address and
affiliation(s) |
| - Contact telephone/fax numbers |
| - E-mail address |
| - Presenter's name |
| - Five keywords |
|
|
|
| Important Dates |
| First announcement |
January 31, 2008 |
| Second announcement |
April 1, 2008 |
| Third announcement |
June 1, 2008 |
| Deadline of submission |
July 1, 2008 |
| Notification of acceptance |
August 22, 2008 |
| Final paper due |
October 20, 2008 |
| Deadline for early-registration |
October 20, 2008 |
| On site registration |
November 27, 2008 |
|
|
|
Home > Call for Papers
