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 Taipei Flash Storage Summit 2009 |
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8:30-9:30AM Registration
9:30-9:45AM Welcome
Mian Quddus, JEDEC Board of Directors Chairman
Dr. Cheng-Wen Wu, General Director of STC/ITRI, Chair of TSIA IC Design Committee
9:45-10:30AM Flash Memory Overview: Technology and Market Trends
Allen Yu, PSC
This session offers a general overview of the flash market and current market trends, basic technical background information, a comparison of SLC and MLC, and the outlook of emerging technologies.
10:30-11:15AM Advances in Flash Technology & Standardization
Cecil Ho, CST
DY Lee, Samsung
Learn about the latest technological trends and technical background information for Multi-Bit technology and next generation DDR NAND standards being developed in JEDEC.
11:15AM- Validation of Today and Tomorrow’s Flash Memory Systems
12:00PM Perry Keller, Agilent
Gain a better understanding of flash memory’s unique validation needs, and learn about the validation requirements for the next generation of flash memories and modules. This session will show design and validation teams how to be ready to execute a smooth validation process to ensure rapid time to market and satisfied customers.
12:00-12:30PM Press Conference
12:00-1:15PM Luncheon Sponsored by TSIA Consumer Electronics Memory Interface Forum
1:15-2:00PM Solid State Drives – Ready to Take Off?
Steffen Hellmold, Seagate
SSDs hold great promise, but when will their true potential be fully realized? Find out the important trends and direction for SSDs in Client and Enterprise computer applications. Learn about the real-world pros and cons of SSDs versus conventional hard drives and how these two technologies will coexist long term in storage architectures.
2:00-2:45PM The Future of Flash Cards
Sung H. Lee, Samsung
Flash Cards have become a primary solution for embedded storage in mobile devices. Find out why and discover more about nonvolatile memory architecture trends for mobile devices, as well as an introduction to the features of MMC v 4.3 and the upcoming v 4.4 specification.
2:45-3:00PM Tea Break Sponsored by TSIA and ITRI
3:00-3:45PM Next Generation Flash Interface – A Multi-Gigabit Per Second High Speed Interface for Embedded and Removable Flash
James Huang, Spansion
Introducing plans for the latest high speed interface card – UFS (Universal Flash Storage). JEDEC UFS is being designed to target a multi-gigabit per second high speed interface for embedded mass storage and removable cards for mobile phones, laptops and consumer electronics devices.
3:45-4:30PM Accelerating UFS Deployment
Kevin Silver, Denali
This session addresses the challenges and strategies for a successful UFS rollout. Special attention is given to hardware and software design and verification methodologies and ecosystem development for rapid deployment of UFS into the marketplace.
Speakers and program are subject to change without notice.
No translation services will be provided.
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Attached file：
Agenda
Registration Form
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